Achi Ir6500 Software -

Visually monitors actual temperatures against your target profile.

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: Saves multiple configuration profiles locally on your computer, eliminating the tedious task of manually keying parameters into the physical station button-by-button. 2. Step-by-Step Software Installation & Driver Setup achi ir6500 software

The Achi IR6500 uses a or PL2303 USB-to-Serial converter chip inside the machine.

Drafts from open windows or air conditioning units can warp your software readings. Ensure your rework station operates in a stable, well-ventilated environment. If you share with third parties, their policies apply

The modern software solution. It features a ribbon-style interface (similar to Microsoft Office), one-click report generation, and compatibility with Windows 10 and 11.

Click or Link . If successful, the software will display the current ambient temperature reported by the machine's thermocouple. 4. How to Program Temperature Profiles : Saves multiple configuration profiles locally on your

Setting up the software can be tricky due to legacy USB-to-Serial drivers. Follow these steps to ensure a flawless connection. Step 1: Install the USB-to-Serial Driver

The ACHI IR6500 remains a powerhouse tool when paired properly with its control software. By moving away from manual button programming and utilizing PC-driven temperature profiles, you eliminate guesswork, safeguard delicate silicon chips, and achieve professional-grade, repeatable BGA repair results. If you are setting up your workstation, tell me:

The ACHI IR6500 is a legendary dark infrared BGA rework station, favored by DIY enthusiasts and professional repair technicians alike. While the hardware is robust, the is the "brain" that determines the success of your reflow or reballing process.

The primary reason to use the software is to program . A typical BGA reflow profile consists of several segments defined by Ramp Rate (r) , Target Temperature (L) , and Dwell/Hold Time (d) . Target Temp (Leaded) Target Temp (Lead-Free) 1. Preheat Slowly warms the chip and board to prevent thermal shock. 100°C–120°C 130°C–150°C 2. Soak Activates the flux and ensures uniform heat distribution. 140°C–150°C 150°C–180°C 3. Ramp Rapidly climbs toward the melting point of the solder. 160°C–170°C 190°C–210°C 4. Reflow Reaches peak temperature to liquify the solder balls. 185°C–190°C 225°C–235°C 5. Cooling Solidifies the solder safely to avoid brittle joints. Controlled drop Controlled drop How to Program a Profile in the Software: Open the Profile Editor in ACHI IR Soft. Input your parameters into the matrix. For example: r1 = 1.00 (Raise temperature by 1°C per second) L1 = 120 (Target 120°C) d1 = 40 (Hold at 120°C for 40 seconds) Repeat this process for segments 2 through 5.